- Dalian Asia Pacific Electronics Co., Ltd. (DAPE for short) was developed from Dalian Yingke Circuit Co., Ltd. (established in Nov.2008) As a high-tech enterprise,DAPE has become a manufacturer of multi-layer high density interconnecting printed circuit boards.
DAPE is located in the scenic city of Dalian,in LinGang Industrial Zone, SanShiLiPu, PuWan New District, with building area more than 24,000 m². Its annual output is 700K m², out of which multi-layer accounts more than 60%.
DAPE closely follows the development trend in digitization, integration,miniaturization,multifunction electronic products of the world,and is committed to producing PCB such as double-sided,multilayer,HDI,heavy copper power supply board,special carbon board for the high-end markets including automotive electronics,high-speed railway,industrial control,medical equipment, aerospace,military,net work communications,advanced electronics.
Profile:
Established on: Nov. 6th, 2013
Land area: 17,278 ㎡ Plant area: 24,000 ㎡
Total investment: 300.5 million RMB.
Registered capital: 60 million RMB
Employees: 350
Business Domain: Development, design, manufacturing and sales of double-sided, multi-layer, HDI PCB, LED aluminum PCB, rigid & flexible PCB.
Production capacity: 60,000m2/month (currently 30,000m2/month)
Address: No.19,GangLong Street, LinGang Industrial Zone, SanShiLiPu, PuWan New District, Dalian, China.
- Dalian Asia Pacific Electronics Co., Ltd. (DAPE for short) was developed from Dalian Yingke Circuit Co., Ltd. (established in Nov.2008) As a high-tech enterprise,DAPE has become a manufacturer of multi-layer high density interconnecting printed circuit boards.
DAPE is located in the scenic city of Dalian,in LinGang Industrial Zone, SanShiLiPu, PuWan New District, with building area more than 24,000 m². Its annual output is 700K m², out of which multi-layer accounts more than 60%.
DAPE closely follows the development trend in digitization, integration,miniaturization,multifunction electronic products of the world,and is committed to producing PCB such as double-sided,multilayer,HDI,heavy copper power supply board,special carbon board for the high-end markets including automotive electronics,high-speed railway,industrial control,medical equipment, aerospace,military,net work communications,advanced electronics.
Profile:
Established on: Nov. 6th, 2013
Land area: 17,278 ㎡ Plant area: 24,000 ㎡
Total investment: 300.5 million RMB.
Registered capital: 60 million RMB
Employees: 350
Business Domain: Development, design, manufacturing and sales of double-sided, multi-layer, HDI PCB, LED aluminum PCB, rigid & flexible PCB.
Production capacity: 60,000m2/month (currently 30,000m2/month)
Address: No.19,GangLong Street, LinGang Industrial Zone, SanShiLiPu, PuWan New District, Dalian, China.
